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Dynamic and thermal buckling behaviors of multi-span honeycomb sandwich panel with arbitrary boundaries

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Journal:Process

All the Authors:Junfu Gao,Lixia Liu,Shupeng Sun,Leilei Zeng

First Author:Min Wang

Correspondence Author:Lun Liu

Discipline:Engineering

Document Type:J

Volume:11

Page Number:2880

Translation or Not:no

Date of Publication:2023-09-01

Included Journals:SCI

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