Hits:

Title of Paper:Dynamic and thermal buckling behaviors of multi-span honeycomb sandwich panel with arbitrary boundaries

Journal:Process

First Author:Min Wang

Correspondence Author:Lun Liu

All the Authors:Junfu Gao,Lixia Liu,Shupeng Sun,Leilei Zeng

Discipline:Engineering

Document Type:J

Volume:11

Page Number:2880

Translation or Not:No

Date of Publication:2023-09

Included Journals:SCI

Release Time:2024-12-03