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A Numerical Approximation Structured by Mixed Finite Element and Upwind Fractional Step Difference for Semiconductor Device with Heat Conduction and Its Numerical Analysis

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Institution:数学学院

Title of Paper:A Numerical Approximation Structured by Mixed Finite Element and Upwind Fractional Step Difference for Semiconductor Device with Heat Conduction and Its Numerical Analysis

Journal:NUMERICAL MATHEMATICS-THEORY METHODS AND APPLICATIONS

First Author:袁益让

All the Authors:李长峰,Tongjun Sun,111400040101

Document Code:FFB7DA4CDC934CA6B8AE959E6877EC86

Volume:10

Issue:3

Page Number:541

Translation or Not:No

Date of Publication:2017-08

Release Time:2019-10-24

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