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Patents

Title : 一种MMC冗余子模块的投切控制方法及系统

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Title:一种MMC冗余子模块的投切控制方法及系统

Affilication of Author(s):电气工程学院

Type of Patent:发明

Application Number:202010229506.5

Number of Inventors:2

Service Invention or Not:no

Application Date:2020-03-27

Publication Date:2021-03-19

Authorization Date:2021-03-19

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