Title of Award : 一种MMC冗余子模块的投切控制方法及系统
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Title:一种MMC冗余子模块的投切控制方法及系统
Institution:电气工程学院
Type of Patent:Invent
Application Number:202010229506.5
Number of Inventors:2
Service Invention or Not:No
Application Date:2020-03-27
Publication Date:2021-03-19
Authorization Date:2021-03-19
Release Time:2021-05-12
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