Research Projects

基于柔性薄膜的6G太赫兹芯片与三维电路集成的研究

Release time::2025-09-03|Hits:

Affiliation of Participant(s):集成电路学院

Leading Scientist:张翼飞

Nature of Project:纵向

Project level:省、部委级

Project Number:1BB28A0F56363FC6E063BE07C2CA33FE

Date of Project Approval:2024-01-01

Scheduled completion time:2026-12-31

Date of Project Completion:2026-12-31

Date of Project Initiation:2024-01-01

Project Approval Number:ZR2023ZD08-1