Huifang Tian
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Patents
修复电子垃圾填埋场卤代有机物的CMC包覆的NZVI颗粒及其制备方法
2023-03-16 Hits:
First Author:孙轶斐
Disigner of the Invention:田慧芳,梁莹,朱天乐,王召旭
Type of Patent:Invent
State of Patent:Authorized patents
Service Invention or Not:no
Authorization Date:2021-10-29
Authorization Date:2021-10-29
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