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Grain boundary passivation in cuprous oxide thin films via nitrogen annealing

Release time:2024-05-14|Hits:

Affiliation of Author(s):材料科学与工程学院

Journal:Materials Science in Semiconductor Processing

First Author:姜江一鸣

Document Code:E2F467C1B6014C4DAA84E7CFADDDE2CD

Issue:171

Number of Words:6

Translation or Not:no

Date of Publication:2024-03-01

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