Paper Publications
Grain boundary passivation in cuprous oxide thin films via nitrogen annealing
Release Time:2024-05-14
  • Institution:
    材料科学与工程学院
  • Journal:
    Materials Science in Semiconductor Processing
  • First Author:
    姜江一鸣
  • Document Code:
    E2F467C1B6014C4DAA84E7CFADDDE2CD
  • Issue:
    171
  • Number of Words:
    6
  • Translation or Not:
    No
  • Date of Publication:
    2024-03
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