Research Projects

超薄非接触式芯片模块制造方法研究

Release time::2024-04-16|Hits:

Affiliation of Participant(s):集成电路学院

Leading Scientist:李玉香

Nature of Project:纵向

Project level:省、部委级

Project Number:F6EBFA045A523B90E053BE07C2CA5B10

Date of Project Approval:2023-01-01

Scheduled completion time:2025-12-31

Date of Project Completion:2025-12-31

Date of Project Initiation:2023-01-01

Project Approval Number:ZR2022ZD05