Title : Experimental investigation and numerical simulation of pure copper foil springback in micro-bending process

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Affiliation of Author(s):材料科学与工程学院

Title of Paper:Experimental investigation and numerical simulation of pure copper foil springback in micro-bending process

Journal:Key Engineering Materials

All the Authors:Guangchun Wang

First Author:Guangchun Wang

Document Code:lw-166233

Translation or Not:no

Date of Publication:2014-06-06