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超高频多协议RFID基带信号集成电路芯片设计

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Project Name:超高频多协议RFID基带信号集成电路芯片设计

Institution:信息科学与工程学院

Leading Scientist:王洪君

Supported by:09科技攻关一批

Nature of Project:纵向

Project Level:省、部委级

Project Participants:王洪君,王洪君,Li Hua,李建文

Project Number:kyxm-25693

Project Approval Number:09GG101007

Date of Project Approval:2009-01-01

Scheduled Completion Time:2011-12-31

Date of Project Completion:2011-12-31

Date of Project Initiation:2009-01-01

Release Time:2019-04-17

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