Title : Covalent S-O Bonding Enables Enhanced Photoelectrochemical Performance of Cu2S/Fe2O3 Heterojunction for Water Splitting

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Affiliation of Author(s):晶体材料研究院

Title of Paper:Covalent S-O Bonding Enables Enhanced Photoelectrochemical Performance of Cu2S/Fe2O3 Heterojunction for Water Splitting

Journal:Small

First Author:张颜

Indexed by:Unit Twenty Basic Research

Document Code:956609014691401581EC72FA561535BF

Volume:17

Issue:30

Number of Words:4

Translation or Not:no

Date of Publication:2021-07-01