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Wang Juan

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Postgraduate (Doctoral)

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Gender:Female
Date of Employment:2004-07-16

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Home > Scientific Research > Paper Publications

Interface microstructure and diffusion mechanism in the diffusion bonding of copper and

Release Time:2019-10-24 Hits:

Institution:材料科学与工程学院
Journal:International Journal for the Joining of Materials
First Author:王娟
All the Authors:李亚江,王娟
Document Code:lw-145845
Number of Words:10
Translation or Not:No
Date of Publication:2006-12

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