Wang Juan

Doctor

Postgraduate (Doctoral)

Personal Information:

Gender:Female
Date of Employment:2004-07-16

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Interface microstructure and diffusion mechanism in the diffusion bonding of copper and

Date of Publication:2006-12-10 Hits:

Affiliation of Author(s):材料科学与工程学院
Journal:International Journal for the Joining of Materials
All the Authors:Wang Juan,liyajiang
First Author:王娟
Document Code:lw-145845
Number of Words:10
Translation or Not:no
Date of Publication:2006-12-10

Pre One:Stress analysis of a Fe3Al/Q235 diffusio bonded joint using finite element analysis

Next One:Effect of bonding time on interfacial microstructure and shear strength of vacuum diffusion bonding super-Ni/NiCr laminated composite to Ti-6Al-4V joint without interlayer

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