山东大学教师主页王娟 The effect of Cu interlayer on microstructure and strength in brazed joint of WC-Co with DC53 steel Home

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Interface microstructure and diffusion mechanism in the diffusion bonding of copper and aluminum

Release Time:2025-01-17 Hits:

Institution:材料科学与工程学院
Journal:International Journal for the Joining of Materials
Key Words:Aluminum;Bonding;Copper;Interfaces (materials);Microstructure;Scanning electron microscopy
First Author:李亚江
Document Code:1395297180587134978
Volume:18
Issue:3-4
Page Number:94-98
Translation or Not:No
Date of Publication:2006-12

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Interface microstructure and diffusion mechanism in the diffusion bonding of copper and aluminum