王朋
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钾插层氧化钼纳米阵列材料及其制备方法和应用
  • Affilication of Author(s):
    晶体材料研究院
  • Type of Patent:
    发明
  • Application Number:
    202210302455.3
  • Number of Inventors:
    8
  • Service Invention or Not:
    no
  • Application Date:
    2022-03-25
  • Publication Date:
    2023-04-07
  • Authorization Date:
    2023-04-07

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