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A Novel Thermally Evaporated Etching Mask for Low-Damage Dry Etching

Release Time:2019-10-24 Hits:

Institution:集成电路学院
Journal:IEEE Transactions on Nanotechnology
First Author:王汉斌
All the Authors:王一鸣,王卿璞,辛倩,韩琳,Song A M
Document Code:E56E2B7ED1104702BAEB516FA27F194D
Volume:16
Issue:2
Page Number:290
Translation or Not:No
Date of Publication:2017-03

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