Patents
Title of Award : 一种体现渗流对岩土体强度弱化的DEM接触模型构建方法
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Title:一种体现渗流对岩土体强度弱化的DEM接触模型构建方法
Institution:岩土与结构工程研究中心
Type of Patent:发明
Application Number:201911414054.1
Number of Inventors:4
Service Invention or Not:No
Application Date:2019-12-31
Publication Date:2021-04-13
Authorization Date:2021-04-13
Release Time:2021-05-21