Hits:
Title:一种基于5G和图嵌入优化的TSVM模型自优化与预测方法、设备及存储介质
Institution:控制科学与工程学院
Type of Patent:Invent
Application Number:202110451360.3
Number of Inventors:2
Service Invention or Not:No
Application Date:2021-04-26
Publication Date:2023-02-03
Authorization Date:2023-02-03
Release Time:2023-02-07