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    高性能物联网晶振基片关键技术研究

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    • Project Name:高性能物联网晶振基片关键技术研究

    • Institution:晶体材料研究院（晶体材料全国重点实验室）

    • Leading Scientist:于法鹏

    • Nature of Project:横向

    • Project Number:B93DFBCDA91166ACE053BE07C2CA8C0C

    • Date of Project Approval:2020-01-01

    • Scheduled Completion Time:2023-12-30

    • Date of Project Completion:2023-12-30

    • Date of Project Initiation:2020-01-01

    • Release Time:2022-05-26
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