中文

高性能物联网晶振基片关键技术研究

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  • Affiliation of Participant(s):晶体材料研究院

  • Leading Scientist:于法鹏

  • Nature of Project:横向

  • Project Number:B93DFBCDA91166ACE053BE07C2CA8C0C

  • Date of Project Approval:2020-01-01

  • Date of Project Initiation:2020-01-01

  • Scheduled completion time:2022-12-19

  • Date of Project Completion:2022-12-19


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