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    硅酸镓镧系列晶体高温零温度补偿切型及应用

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    • Title:硅酸镓镧系列晶体高温零温度补偿切型及应用

    • Institution:晶体材料研究所

    • Application Number:201010011815.1

    • Number of Inventors:6

    • Service Invention or Not:No

    • Application Date:2010-01-07

    • Release Time:2019-01-26
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