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硅酸镓镧系列晶体高温零温度补偿切型及应用

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  • Affilication of Author(s):晶体材料研究所

  • Disigner of the Invention:yinxin,guoshiyi,duanxiulan,zhaoxian

  • Application Number:201010011815.1

  • Number of Inventors:6

  • Service Invention or Not:no

  • Application Date:2010-01-07

  • Application Date:2010-01-07
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