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Influence of temperature on the soldering process of CLCC-3 package components using AuSn20 solder

Release time:2022-09-18|Hits:

Affiliation of Author(s):材料科学与工程学院

Journal:AIP ADVANCES

First Author:赵志桓

Document Code:A963135640904E3F916CBC2CB2A839B5

Volume:10

Issue:5

Number of Words:6

Translation or Not:no

Date of Publication:2020-05-01

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