Influence of crystal orientation and incident plane on n-type 4H-SiC wafer slicing by using picosecond laser

Release time:2024-12-20|Hits:

Affiliation of Author(s):新一代半导体材料研究院

Journal:OPTICS AND LASER TECHNOLOGY Journal

First Author:姚勇平

Document Code:764B6DD20F3D4C4E924F28801FA7D505

Issue:Volume182,PartB

Number of Words:5

Translation or Not:no

Date of Publication:2024-11-24