Project Name:PCB warpage应力模型仿真技术
Institution:材料科学与工程学院
Leading Scientist:贾玉玺
Nature of Project:横向
Project Number:1B9EB02A75706F16E063BE07C2CA9939
Date of Project Approval:2024-06-17
Scheduled Completion Time:2025-01-16
Date of Project Completion:2025-01-16
Date of Project Initiation:2024-06-17
Release Time:2024-06-26