Institution:材料科学与工程学院
Title of Paper:基于VOF/PLIC界面追踪方法的RTM工艺充模过程数值模拟
Journal:材料研究学报
First Author:张国芳
All the Authors:张国芳
Document Code:lw-140845
Volume:23
Issue:6
Page Number:622
Number of Words:4
Translation or Not:No
Date of Publication:2009-12
Release Time:2019-10-24