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Institution:电气工程学院
Title of Paper:Insulation Failure Mechanism of Polyimide under High-Frequency Electrical Stress: A Synergistic Analysis of Aging Experiments and Molecular Dynamics Simulations
Journal:IEEE Transactions on Dielectrics and Electrical Insulation
First Author:王议伟
Document Code:0ADDC2DB53564161869DEEE7C1EF0771
Issue:1
Number of Words:6
Translation or Not:No
Date of Publication:2025-02
Release Time:2025-05-27