- Insulation Failure Mechanism of Polyimide under High-Frequency Electrical Stress: A Synergistic Analysis of Aging Experiments and Molecular Dynamics Simulations
- 点击次数:
- 所属单位:电气工程学院
- 发表刊物:IEEE Transactions on Dielectrics and Electrical Insulation
- 第一作者:王议伟
- 论文编号:0ADDC2DB53564161869DEEE7C1EF0771
- 期号:1
- 字数:6
- 是否译文:否
- 发表时间:2025-02-14