超薄非接触式芯片模块制造方法研究
Release Time:2024-04-16
Hits:
- Project Name:
- 超薄非接触式芯片模块制造方法研究
- Institution:
- 集成电路学院
- Leading Scientist:
- 李玉香
- Nature of Project:
- 纵向
- Project Level:
- 省、部委级
- Project Number:
- F6EBFA045A523B90E053BE07C2CA5B10
- Project Approval Number:
- ZR2022ZD05
- Date of Project Approval:
- 2023-01-01
- Scheduled Completion Time:
- 2025-12-31
- Date of Project Completion:
- 2025-12-31
- Date of Project Initiation:
- 2023-01-01
- Release Time:
- 2024-04-16
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