Current position: Home >> Scientific Research >> Research Projects

基于柔性薄膜的 6G 太赫兹芯片与三维电路集成的研究(子课题2)

Hits:

Affiliation of Participant(s):集成电路学院

Leading Scientist:张锡健

Nature of Project:纵向

Project Number:1C53597F33313C16E063BE07C2CAE0DC

Date of Project Approval:2024-01-01

Scheduled completion time:2026-12-30

Date of Project Completion:2026-12-30

Date of Project Initiation:2024-01-01

Project Approval Number:ZR2023ZD08-3

Next One:BM晶体管V2技术合作项目