基于柔性薄膜的 6G 太赫兹芯片与三维电路集成的研究（子课题2）
Release Time:2024-08-01
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- Project Name:
- 基于柔性薄膜的 6G 太赫兹芯片与三维电路集成的研究（子课题2）
- Institution:
- 集成电路学院
- Leading Scientist:
- 张锡健
- Nature of Project:
- 纵向
- Project Number:
- 1C53597F33313C16E063BE07C2CAE0DC
- Project Approval Number:
- ZR2023ZD08-3
- Date of Project Approval:
- 2024-01-01
- Scheduled Completion Time:
- 2026-12-30
- Date of Project Completion:
- 2026-12-30
- Date of Project Initiation:
- 2024-01-01
- Release Time:
- 2024-08-01
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