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一种基于切趾光栅的高功率硅基半导体激光器
2024-05-31  Hits:

Affilication of Author(s):信息科学与工程学院
Type of Patent:发明
Application Number:202210486992.8
Number of Inventors:2
Service Invention or Not:no
Application Date:2022-05-06
Publication Date:2024-05-28
Authorization Date:2024-05-28
Publication Date:2024-05-28
Application Date:2022-05-06
Authorization Date:2024-05-28