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高性能物联网晶振基片关键技术研究
Release Time:2022-05-26
  • Institution:
    晶体材料研究院（晶体材料全国重点实验室）
  • Leading Scientist:
    于法鹏
  • Nature of Project:
    横向
  • Project Number:
    B93DFBCDA91166ACE053BE07C2CA8C0C
  • Date of Project Approval:
    2020-01-01
  • Scheduled Completion Time:
    2023-12-30
  • Date of Project Completion:
    2023-12-30
  • Date of Project Initiation:
    2020-01-01
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