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Institution:国家胶体材料工程技术研究中心

Title of Paper:Repairing Creep-Resistant and Kinetically Inert Hydrogels via Yeast Activity-Regulated Energy Dissipation

Journal:ACS Applied Bio Materials

First Author:钟渊博

Document Code:1E2E4A56E6C849379879F7D28DC39297

Volume:3

Issue:7

Page Number:4507

Number of Words:5

Translation or Not:No

Date of Publication:2020-06

Release Time:2021-05-19