Development of the manufacture equipment for resin bonded diamond abrasive wire saw
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Institution:机械工程学院
Title of Paper:Development of the manufacture equipment for resin bonded diamond abrasive wire saw
Journal:Advanced Materials research
First Author:葛培琪
All the Authors:毕文波,高玉飞,Zhu Zhenjie
Document Code:lw-135289
Volume:588-589
Page Number:1694
Translation or Not:No
Date of Publication:2012-09
Release Time:2019-10-22