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Institution:机械工程学院

Title of Paper:Development of the manufacture equipment for resin bonded diamond abrasive wire saw

First Author:葛培琪

All the Authors:毕文波,高玉飞,Zhu Zhenjie,葛培琪

Document Code:lw-135289

Volume:588-589

Page Number:1694

Translation or Not:No

Date of Publication:2012-09

Release Time:2019-10-24