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Si/InP direct wafer bonding: A first-principles study
  • Affiliation of Author(s):
    光学高等研究中心
  • Journal:
    Computational Materials Science
  • First Author:
    康汝燕
  • Document Code:
    1787758664933990402
  • Volume:
    241
  • Number of Words:
    3
  • Translation or Not:
    no
  • Date of Publication:
    2024-05-25

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