左致远
Professor
Visit:次
Paper Publications
Home
Si/InP direct wafer bonding: A first-principles study
  • Institution:
    光学高等研究中心
  • Title of Paper:
    Si/InP direct wafer bonding: A first-principles study
  • Journal:
    Computational Materials Science
  • First Author:
    康汝燕
  • Document Code:
    1787758664933990402
  • Volume:
    241
  • Number of Words:
    3
  • Translation or Not:
    No
  • Date of Publication:
    2024-05
  • Release Time:
    2025-01-08
Copyright All Rights Reserved Shandong University Address: No. 27 Shanda South Road, Jinan City, Shandong Province, China: 250100
Information desk: (86) - 0531-88395114
On Duty Telephone: (86) - 0531-88364731 Construction and Maintenance: Information Work Office of Shandong University