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Nanoscale Component Diffusion Study of InP/SiC Heterogeneous Bonding Interface for High-Quality Optoelectronic Device Integration
  • Institution:
    光学高等研究中心
  • Title of Paper:
    Nanoscale Component Diffusion Study of InP/SiC Heterogeneous Bonding Interface for High-Quality Optoelectronic Device Integration
  • Journal:
    ACS Applied Nano Materials
  • First Author:
    康汝燕
  • Document Code:
    1843556244069126146
  • Volume:
    7
  • Issue:
    18
  • Page Number:
    21547-21555
  • Number of Words:
    6
  • Translation or Not:
    No
  • Date of Publication:
    2024-09
  • Release Time:
    2025-01-08
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