Date of Publication:2018-01-01 Hits:
Journal:IEEE Trans. Compon. Packag. Manuf. Technol.
All the Authors:R. D. Martin, S. Shi, A. A. Wright, P. Yao, K. Shreve, D. Mackrides, C. Harrity, and D. W. Prather
First Author:Y. Zhang
Volume:8
Issue:12
Page Number:2180-2189
Translation or Not:no
Date of Publication:2018-01-01
Date of Publication:2018-01-01