Yifei Philip Zhang
Professor
Visit:次
Paper Publications
Home
95-GHz front-end receiving multichip module on multilayer LCP substrate for passive millimeter-wave imaging
  • Journal:
    IEEE Trans. Compon. Packag. Manuf. Technol.
  • All the Authors:
    R. D. Martin, S. Shi, A. A. Wright, P. Yao, K. Shreve, D. Mackrides, C. Harrity, and D. W. Prather
  • First Author:
    Y. Zhang
  • Volume:
    8
  • Issue:
    12
  • Page Number:
    2180-2189
  • Translation or Not:
    no
  • Date of Publication:
    2018-01-01

Pre One:Two-terminal InGaAs microwave amplifier

Next One:Packaging of high-gain multichip module in multilayer LCP substrates at W-band

Copyright All Rights Reserved Shandong University Address: No. 27 Shanda South Road, Jinan City, Shandong Province, China: 250100
Information desk: (86) - 0531-88395114
On Duty Telephone: (86) - 0531-88364731 Construction and Maintenance: Information Work Office of Shandong University