Journal:IEEE Trans. Compon. Packag. Manuf. Technol.
All the Authors:S. Shi, A. A. Wright, P. Yao, R. D. Martin, K. Shreve, C. Harrity, and D. W. Prather
First Author:Y. Zhang
Volume:7
Issue:10
Page Number:1655-1662
Translation or Not:no
Date of Publication:2017-01-01
Date of Publication:2017-01-01
Philip Zhang
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Gender:Male
Education Level:Postgraduate (Doctoral)
Alma Mater:University of Delaware
Paper Publications
Packaging of high-gain multichip module in multilayer LCP substrates at W-band
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