Yifei Philip Zhang
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Packaging of high-gain multichip module in multilayer LCP substrates at W-band
  • Journal:
    IEEE Trans. Compon. Packag. Manuf. Technol.
  • All the Authors:
    S. Shi, A. A. Wright, P. Yao, R. D. Martin, K. Shreve, C. Harrity, and D. W. Prather
  • First Author:
    Y. Zhang
  • Volume:
    7
  • Issue:
    10
  • Page Number:
    1655-1662
  • Translation or Not:
    no
  • Date of Publication:
    2017-01-01

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