Tong Gao

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A novel heat-resistant Al–Si–Cu–Ni–Mg base material synergistically strengthened by Ni-rich intermetallics and nano-AlNp microskeletons
Release Time:2019-10-25| Hits:

Institution:材料科学与工程学院
Title of Paper:A novel heat-resistant Al–Si–Cu–Ni–Mg base material synergistically strengthened by Ni-rich intermetallics and nano-AlNp microskeletons
Journal:JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
First Author:Liu Xiangfa
All the Authors:孙谦谦,Tong Gao,Liu Xiangfa
Document Code:FA8984A3B48D4553B3B8E64668F1B05A
Translation or Not:No
Date of Publication:2019-03
Release Time:2019-10-25