Tong Gao
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Paper Publications
A novel heat-resistant Al–Si–Cu–Ni–Mg base material synergistically strengthened by Ni-rich intermetallics and nano-AlNp microskeletons
2019-03-14 Hits:
Affiliation of Author(s):材料科学与工程学院
Journal:JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
All the Authors:Liu Xiangfa,sunqianqian,Tong Gao
First Author:Liu Xiangfa
Indexed by:Unit Twenty Basic Research
Document Code:FA8984A3B48D4553B3B8E64668F1B05A
Translation or Not:no
Date of Publication:2019-03-14
Date of Publication:2019-03-14
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