Tong Gao

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A novel heat-resistant Al-Si-Cu-Ni-Mg base material synergistically strengthened by Ni-rich intermetallics and nano-AlNp microskeletons
Release Time:2021-06-01| Hits:

Institution:材料科学与工程学院
Title of Paper:A novel heat-resistant Al-Si-Cu-Ni-Mg base material synergistically strengthened by Ni-rich intermetallics and nano-AlNp microskeletons
Journal:Journal of Materials Science and Technology
First Author:胡恺琪
Document Code:61123AC82B7544CBBD7FA5B5309ED7E6
Volume:35
Issue:3
Page Number:306
Number of Words:4
Translation or Not:No
Date of Publication:2019-03
Release Time:2021-06-01