Tong Gao
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Paper Publications
A novel heat-resistant Al-Si-Cu-Ni-Mg base material synergistically strengthened by Ni-rich intermetallics and nano-AlNp microskeletons
2019-03-01 Hits:
Affiliation of Author(s):材料科学与工程学院
Journal:Journal of Materials Science and Technology
First Author:胡恺琪
Indexed by:Unit Twenty Basic Research
Document Code:61123AC82B7544CBBD7FA5B5309ED7E6
Volume:35
Issue:3
Page Number:306
Translation or Not:no
Date of Publication:2019-03-01
Date of Publication:2019-03-01
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