Title : Thermal-Aware On-chip Memory Architecture Exploration

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Affiliation of Author(s):计算机科学与技术学院

Title of Paper:Thermal-Aware On-chip Memory Architecture Exploration

Journal:12th IEEE International Conference on Trust, Security and Privacy in Computing and Communications, TrustCom 2013

All the Authors:Ju Lei

First Author:jiazhiping

Indexed by:Applied Research

Document Code:lw-144505

Translation or Not:no

Date of Publication:2013-07-16