Title : Thermal-Aware On-chip Memory Architecture Exploration
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Affiliation of Author(s):计算机科学与技术学院
Title of Paper:Thermal-Aware On-chip Memory Architecture Exploration
Journal:12th IEEE International Conference on Trust, Security and Privacy in Computing and Communications, TrustCom 2013
All the Authors:jiazhiping,Ju Lei
First Author:jiazhiping
Document Code:lw-144505
Translation or Not:no
Date of Publication:2013-07-16
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