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一种利用正交模态的叠加提高微谐振器品质因子的方法及其实现装置

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Affilication of Author(s):晶体材料研究院

Patent Applicant:Duo Liu

Type of Patent:发明

Application Number:201811569685.6

Number of Inventors:1

Service Invention or Not:no

Publication Date:2021-08-13

Authorization Date:2021-08-13

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