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Title:利用内共振提升微谐振器模态振幅和温度灵敏度的方法
Institution:新一代半导体材料研究院
Type of Patent:Invent
Application Number:202411942039.5
Number of Inventors:1
Service Invention or Not:No
Application Date:2024-12-27
Publication Date:2025-04-25
Authorization Date:2025-04-25
Release Time:2025-07-16