Title of Project : 大尺寸半导体SiC单晶衬底材料

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Project Name:大尺寸半导体SiC单晶衬底材料

Affiliation of Participant(s):晶体材料研究所

Leading Scientist:xuxiangang

Supported by:科技部 863

Nature of Project:纵向

Project level:National

Project Participants:xuxiangang,jiangminhua,liuhong,dongchunming

Project Number:kyxm-28568

Date of Project Approval:2001-07-01

Scheduled completion time:2004-06-30

Date of Project Completion:2004-06-30

Date of Project Initiation:2001-07-01

Project Approval Number:01597