Title of Award : 大尺寸半导体SiC单晶衬底材料
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Project Name:大尺寸半导体SiC单晶衬底材料
Institution:晶体材料研究院(晶体材料全国重点实验室)
Leading Scientist:徐现刚
Supported by:科技部 863
Nature of Project:纵向
Project Level:National
Project Participants:徐现刚,董春明,徐现刚,胡小波,蒋民华,刘宏
Project Number:kyxm-28573
Project Approval Number:01AA311080
Date of Project Approval:2002-01-01
Scheduled Completion Time:2004-06-30
Date of Project Completion:2004-06-30
Date of Project Initiation:2002-01-01
Release Time:2019-04-18
The Last Update Time : ..