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一种半导体异质结气敏材料及其制备方法和应用
Release Time:2019-09-12| Hits:
Title:一种半导体异质结气敏材料及其制备方法和应用
Institution:材料科学与工程学院
Type of Patent:Invent
Application Number:201910872026.8
Number of Inventors:5
Service Invention or Not:No
Application Date:2019-09-16
Publication Date:2020-09-18
Authorization Date:2020-09-18
Release Time:2019-09-12
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