Title : Development of fluxes for selected Sn-Cu based lead-free solders
Hits :
Affiliation of Author(s):材料科学与工程学院
Title of Paper:Development of fluxes for selected Sn-Cu based lead-free solders
Journal:2005 6th International Conference on Electronics Packaging Technology
All the Authors:yangmin,liuxiuzhong
First Author:杨敏
Document Code:lw-141719
Page Number:258
Translation or Not:no
Date of Publication:2005-08-30
The Last Update Time : ..