刘秀忠   

Title:Professor

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Language：English

Paper Publications

Title : Development of Sn-Zn-Cu Lead Free Solder

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Affiliation of Author(s):材料科学与工程学院

Title of Paper:Development of Sn-Zn-Cu Lead Free Solder

Journal:ICEPT-HDP 2010

All the Authors:yangmin,liuxiuzhong

First Author:杨敏

Document Code:lw-141488

Page Number:784

Number of Words:5

Translation or Not:no

Date of Publication:2010-08-16

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