Paper Publications
Title of Award : Microstructure and property of Sn-Zn-Cu-Bi lead free solder
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Institution:材料科学与工程学院
Title of Paper:Microstructure and property of Sn-Zn-Cu-Bi lead free solder
Journal:ICEPT-HDP 2010
First Author:杨敏
All the Authors:刘秀忠
Document Code:lw-141493
Page Number:789
Translation or Not:No
Date of Publication:2010-08
Release Time:2019-10-24