刘秀忠   

Title:Professor

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Language：English

Paper Publications

Title : Microstructure and property of Sn-Zn-Cu-Bi lead free solder

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Affiliation of Author(s):材料科学与工程学院

Title of Paper:Microstructure and property of Sn-Zn-Cu-Bi lead free solder

Journal:ICEPT-HDP 2010

All the Authors:liuxiuzhong

First Author:杨敏

Indexed by:Applied Research

Document Code:lw-141493

Page Number:789

Translation or Not:no

Date of Publication:2010-08-16

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