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Combination of direct ink writing and reaction bonded for rapid fabrication of SiCw/SiC composites

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Affiliation of Author(s):Shandong University, Weihai

Journal:Ceramics International

Key Words:Direct ink writingSilicon carbide whiskersReaction bonded silicon carbideMechanical propertyMicrostructure

Abstract:Silicon carbide ceramic matrix composites are widely used in aerospace field due to their advantages of high temperature resistance, high strength and corrosion resistance. However, its application is greatly limited because of the difficulty in preparing complex shape structures by traditional machining methods. Here, a new strategy for preparing SiCw/SiC complex structure by combining direct ink writing with reaction bonding is proposed. A water-based slurry consisting of silicon carbide, carbon powder and silicon carbide whisker was developed. The influence laws of C content and SiCw content in slurry on sintering properties of direct-written samples were studied. The reaction bonding mechanism and whisker reinforcing and toughening mechanism were analyzed by means of microstructure and phase composition. The results show that the slurry exhibits shear thinning behavior with stress yield point, and its flow behavior and plasticity meet the requirements of direct writing. When the carbon content is 6.4 wt%, the maximum flexural strength is 239.3 MPa. When 15 wt% SiCw was added, the flexural strength of the composite reached 301.6 MPa, and when 20 wt% SiCw was added, the fracture toughness of the composite reached 4.02 MPa m1/2, which was increased by 26% and 18% compared with single-phase SiC, respectively. The reinforcing and toughening mechanisms of the whiskers mainly include whisker pullout, crack deflection and whisker bridging. After direct ink writing and reaction bonded, the whole process shows good near net forming ability. 3D printed SiCw/SiC composites have great application prospects in aerospace field.

All the Authors:Yuju Che, Zhonghua Chen

First Author:Haichao Xu

Indexed by:Research Paper

Correspondence Author:Yong Liu

Document Code:10.1016/j.ceramint.2022.09.002

Document Type:Journal article

Volume:49

Issue:1

Page Number:392-402

ISSN No.:0272-8842

Translation or Not:no

Date of Publication:4492-07-01

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