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Intelligent identification of material removal behavior during scratching of 4H-SiC based on acoustic emission sensing and unsupervised deep learning
Release Time:2025-10-06
  • Institution:
    机械工程学院
  • Journal:
    Materials Science in Semiconductor Processing
  • First Author:
    张瑞豪
  • Document Code:
    949D5A5A5FEA406C8F6DFA8DDCBE2689
  • Volume:
    190
  • Issue:
    1
  • Page Number:
    109358
  • Number of Words:
    4
  • Translation or Not:
    No
  • Date of Publication:
    2025-05
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