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Project Name:基于柔性薄膜的6G太赫兹芯片与三维电路集成的研究(子课题1)
Institution:集成电路学院
Leading Scientist:时彦朋
Nature of Project:纵向
Project Number:1C6569F7612873A7E063BE07C2CAB643
Project Approval Number:ZR2023ZD08-2
Date of Project Approval:2024-01-01
Scheduled Completion Time:2026-12-30
Date of Project Completion:2026-12-30
Date of Project Initiation:2024-01-01
Release Time:2024-08-01